채용제목 Advanced Packaging POC techinical leader (Heat Sink) (지원마감) 회사소개 반도체사 업무내용/자격요건 담당직무-Advanced packaging new ideas ideation-Market trend survey, competitors benchmarking-Advanced packaging new materials, new equipment, new process study, survey-Join R&D activities with customers, partners (institutes, equipment, material suppliers) -Advanced packaging design proposal, value propositions analysis and suggestion-Advanced packaging proof-of-concept demonstration, characterization, reliability [자격요건]-Strong knowledge and hands-on experience on semiconductor packaging technologies, process, materials, equipment-Strong understanding of embedding and Cu plating (1 T/L)-Strong problem solving, diagnosis technique and data analysis skill-Strong English communication skill-Bachelor (> 10 years), Master (> 7 years) or Ph D degree (> 5 years) in Physics, Materials, Mechanical Engineering, Mechanics, Metallurgy, Electronics, Electric engineering[전형절차]서류전형- 인터뷰[제출서류] 영문이력서자격요건-Strong knowledge and hands-on experience on semiconductor packaging technologies, process, materials, equipment-Strong understanding of embedding and Cu plating (1 T/L)-Strong problem solving, diagnosis technique and data analysis skill-Strong English communication skill-Bachelor (> 10 years), Master (> 7 years) or Ph D degree (> 5 years) in Physics, Materials, Mechanical Engineering, Mechanics, Metallurgy, Electronics, Electric engineering[전형절차]서류전형- 인터뷰[제출서류] 영문이력서전형절차서류전형- 인터뷰[제출서류] 영문이력서제출서류 영문이력서 기타사항 학력 : 학력무관, 나이:무관, 성별 : 무관, 외국어 : 무관 직급 : 부장까지 가능 근무지 : 부천