- Concept and development of new package design- Manufacturing Review, Design Rules Review, worksheet documentation- Design for requirements- Start and maintain Design FMEA for package platform- Conduct DOE and process, material characterization, and robustness research- drawing/documentation/Marking and Bonding Diagrams, BOM- Establish process flow and important/new control plan-Package development documentation- Review package feasibility including simulation, proof of concept, technology demonstration and technology release phase- Prototype/concept design and engineering builds support-.

Major in electrical/electronic or material science ( preferred)-.

Understanding of semiconductor fabrication process and device physics-.

Familiarity with device/process simulation-.

Knowledge of power electronics-.

Strong communication skills in English